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Commerce Department Expands CHIPS Act Direct Grants to Accelerate Domestic Advanced Packaging and Foundry Capacity
FEATURED • TechnologyCommerce Department Expands CHIPS Act Direct Grants to Accelerate Domestic Advanced Packaging and Foundry Capacity

The U.S. Department of Commerce announced a fresh tranche of direct capital subsidies under the CHIPS and Science Act, focusing on advanced multi-die packaging infrastructure and domestic 2nm foundry expansions in Ohio, Arizona, and New York.

NewsFlashPro Editorial••6 min read

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